A PC cooling accessory designed to keep M.2 NVMe drives running cooler and avoiding thermal throttling, ideal for sustained workloads. Quiet, solid-feeling hardware can give peace of mind to builders and content creators who push storage hard. Is the fit and performance right for your NVMe setup, especially where space is limited, with the Thermalright HR-09 2280 SSD heatsink?
⚡ At a Glance
- • Heat Dissipation: Large fin array and heat pipe spread heat across a wide area
- • Best for: PC builders and gamers needing lower NVMe temperatures under sustained load
- • Not ideal for: Systems without enough clearance for a 79×24×48mm heatsink
Aluminium alloy construction combines a 6mm AGHP reverse gravity heat pipe with a 45,000mm² fin area to move heat away from M.2 controllers. A high-conductivity silicone pad improves contact with uneven components for steadier operating temperatures.
Lower sustained temperatures - thanks to a 6mm AGHP generation 3 reverse gravity heat pipe
The single 6mm AGHP reverse gravity heat pipe transfers thermal energy from the M.2 module into a dense array of 32 aluminium fins distributed across 45,000mm² of surface. Electroplating on the pure aluminium base and fins improves thermal conduction across surfaces.
Reduced hotspots mean a lower chance of NVMe throttling during long transfers or heavy workloads, keeping performance steadier under load.
Improved contact with controller and NAND - with the Advancing Gene nano thermal silicone pad (14.8 W/m·K)
A second-generation nano thermal pad rated at 14.8 W/m·K conforms to uneven PCB components with low viscosity, while the electroplated base ensures consistent thermal junctions. Reflow welding and a pure-aluminium base maximise conductive paths.
Better heat transfer from chip to heatsink reduces peak temperatures on small hotspots, making sustained reads and writes less likely to trigger throttling.
Versatile mounting and secure hold - thanks to double-sided clip design and six adjustable height screws
A clip mechanism with stainless-steel bottom support plus six adjustable screws accommodates M.2 modules of varying heights and maintains stable pressure across the module surface. The decorative aluminium top cover and fixed bottom surface reinforce rigidity.
Flexible installation suits many M.2 builds and ensures reliable contact without excessive pressure that could damage components.
✨ The 4 Key Reasons for Thermalright HR-09 2280 SSD heatsink
- Premium aluminium construction, durable finish that aids heat transfer, Durable aluminium build resists wear and aids heat transfer.
- Adjustable mounting system, fits a range of M.2 heights and form factors, Fits different NVMe sizes thanks to adjustable height screws.
- High-conductivity thermal pad, conforms to uneven surfaces for reliable contact, Conforms to uneven surfaces for consistent contact and cooling.
- Measured cooling improvement, quoted 10°C to 30°C drop depending on environment, Lowers NVMe temperatures by up to 30°C under favourable conditions.
📋 Technical Details at a Glance
- Category: M.2 SSD heatsink
- Model: HR-09 2280
- Size (L×W×H): 79 × 24 × 48 mm
- Body material: Aluminium alloy
- Colour: Silver grey
❓ Frequently Asked Questions
Q: Will the heatsink fit all M.2 NVMe SSDs?
A: The double-sided clip design with six adjustable height screws accommodates M.2 SSDs of various heights, but the heatsink measures 79×24×48mm so check board clearance before fitting.
Q: How much cooler will an NVMe run with this heatsink?
A: Double-sided cooling claims a 10°C to 30°C reduction depending on environment and system airflow, so expect meaningful drops under sustained load but results vary with case ventilation.
Q: Is installation difficult for a typical desktop build?
A: Installation uses a clip system and adjustable screws for a stable fit, making it straightforward on motherboards with sufficient clearance and standard M.2 mounting points.
🏆 Our Verdict
Ideal for builders, gamers and content creators who need to keep NVMe drives cool during prolonged transfers. A combination of a 6mm AGHP heat pipe, large electroplated fin array and a high-conductivity nano thermal pad delivers practical temperature reductions. While upfront commitment to board clearance is required, the robust construction and measurable cooling make it a sensible long-term upgrade for sustained performance.
